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[Korean]
The Effect of Diffusion Barrier and thin Film Deposition Temperature on Change of Carbon Nanotubes Length
Soon-kyu Hong, Hyung Woo Lee
J Korean Powder Metall Inst. 2016;24(3):248-253.   Published online June 1, 2016
DOI: https://doi.org/10.4150/KPMI.2017.24.3.248
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AbstractAbstract PDF

In this study, we investigate the effect of the diffusion barrier and substrate temperature on the length of carbon nanotubes. For synthesizing vertically aligned carbon nanotubes, thermal chemical vapor deposition is used and a substrate with a catalytic layer and a buffer layer is prepared using an e-beam evaporator. The length of the carbon nanotubes synthesized on the catalytic layer/diffusion barrier on the silicon substrate is longer than that without a diffusion barrier because the diffusion barrier prevents generation of silicon carbide from the diffusion of carbon atoms into the silicon substrate. The deposition temperature of the catalyst and alumina are varied from room temperature to 150°C, 200°C, and 250°C. On increasing the substrate temperature on depositing the buffer layer on the silicon substrate, shorter carbon nanotubes are obtained owing to the increased bonding force between the buffer layer and silicon substrate. The reason why different lengths of carbon nanotubes are obtained is that the higher bonding force between the buffer layer and the substrate layer prevents uniformity of catalytic islands for synthesizing carbon nanotubes.

Citations

Citations to this article as recorded by  
  • A Study on Residual Powder Removing Technique of Multi-Layered Graphene Based on Graphene One-Step Transfer Process
    Chae-young Woo, Yeongsu Jo, Soon-kyu Hong, Hyung Woo Lee
    Journal of Korean Powder Metallurgy Institute.2019; 26(1): 11.     CrossRef
  • Fabrication of robust, ultrathin and light weight, hydrophilic, PVDF-CNT membrane composite for salt rejection
    Vivek Dhand, Soon Kyu Hong, Luhe Li, Jong-Man Kim, Soo Hyung Kim, Kyong Yop Rhee, Hyung Woo Lee
    Composites Part B: Engineering.2019; 160: 632.     CrossRef

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